Apple is preparing to launch its first foldable iPhone Fold, which will feature the next-generation A20 Pro chip, the same one that will power the iPhone 18 Pro and iPhone 18 Pro Max models, according to industry analyst Jeff Pu.
See also: iPhone 18 Pro & iPhone Fold feature details
The iPhone Fold will be powered by the A20 Pro chip, which will use TSMC. This process promises performance improvements that can be up to 15% faster and 30% more efficient than the A19 chips.
Additionally, the A20 Pro chips will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology . With WMCM, the RAM will be integrated directly into the same wafer as the CPU, GPU, and Neural Engine, rather than being next to the chip and connected via an intermediate silicon.
See also: iPhone Fold: Will it be made of Liquid Metal and Improved Titanium?
The upgrade to WMCM is expected to deliver faster performance for Apple Intelligence and longer battery life, while also reducing the size of the A20 chip, leaving more space inside the iPhone for other components. This change in the packaging of the A20 chip has already been rumored.
Pu's note also outlined other specifications that the Pro and Fold models are expected to share, such as 12GB LPD5 RAM, 48-megapixel rear cameras, and Apple's C2 modem.
See also: iPhone Fold paves the way for thinner, brighter display
Apple's first foldable iPhone is rumored to feature a wide, book-like design with a 7.8-inch internal display and a 5.5-inch external display, a bezel-less display, Touch ID, and a front-facing camera in both folded and unfolded states. The device could be just 4.5mm thick when unfolded and between 9mm and 9.5mm when closed.
