An alleged image of the iPhone 18 Pro ’s motherboard has leaked online, sparking intense interest in the tech community. The image reveals that the A20 Pro chip will use a new packaging technology, which is expected to offer significant performance improvements over the previous model. The leak, shared by the accounts “ WHYLAB ” and “ Ice Universe ” on Weibo, appears to show the A20 Pro chip built into TSMC ’s new packaging architecture , known as Wafer-Level Multi-Chip Module (WMCM) technology .
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Apple's traditional approach to chip packaging involves using package-on-package (PoP) designs, where the DRAM is placed directly on top of the application processor. This method offers advantages such as lower power consumption and reduced latency, but it concentrates heat in the package area, causing overheating issues. In the leaked WMCM implementation, the DRAM has been moved to the side of the package.
This change is expected to reduce thermal coupling between the processor and DRAM, while improving heat dissipation during prolonged workloads.
The new packaging technology isn’t the only innovation the iPhone 18 Pro brings. Apple’s design is said to feature LPDDR6 memory with a 96-bit memory bus, providing more energy-efficient bandwidth. This means users can expect improved performance in applications that require high data transfer rates, such as games and video editing applications.
The A20 Pro chip is said to be about the same size as the A19 Pro, but the Neural Processing Unit (NPU) appears to be significantly larger. This suggests that Apple is also aiming to improve AI performance, which is crucial for modern AI-based applications like voice and image recognition.
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The leaked image has not been confirmed as authentic, but WMCM technology has been repeatedly rumored for the iPhone 18 Pro and iPhone 18 Pro Max. Powered by the A20 Pro chip, the foldable iPhone and iPhone 18 Pro models are also expected to use TSMC’s new 2nm process, also known as N2. This process promises performance improvements that could be up to 15 percent faster and 30 percent more efficient than the A19 chips.
In addition, the N2 introduces new ultra-high-performance metal-insulator-metal (SHPMIM) capacitors to the chip's power supply system. These capacitors more than double the capacitance density of the previous generation. Together with the adoption of WMCM, the changes are expected to enhance global performance and improve power stability and energy efficiency.
The Pro and Fold models are expected to share 12GB of RAM, 48-megapixel rear cameras, and Apple's C2 modem. These specs suggest that Apple continues to invest in camera quality and connectivity, two areas that are critical for modern smartphone users. All three models are expected to launch in September of this year, giving consumers new options for powerful and efficient smartphones.
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The anticipated launch of the iPhone 18 Pro with new technologies and performance improvements is expected to strengthen Apple's position in the premium smartphone market. These improvements are not only technical, but also have practical consequences for users, offering a better user experience and longer battery life. Organizations that rely on mobile devices for business applications can also benefit from the increased performance and energy efficiency of the new models.
