The Exynos 2400 is a respectable top-end processor, although it was noted to be more prone to overheating than the Snapdragon 8 Gen 3.Now, it seems that Samsung has a new cooling solution up its sleeve for future Exynos chipsets.
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Elec reports that Samsung is working on a new chip packaging technology called fan-out wafer-level package-HPB (FOWLP-HPB). This technology involves attaching a type of heat sink, called a heat path block (HPB), to the top of the chipset.
The outlet reports that this cooler technology comes from PCs and servers and is expected to be used in future Exynos processors. The site added that the technology is only now making its way to smartphones, due to their smaller form factor, suggesting that miniaturizing the technology has been a challenge.
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It is believed that the development of the technology will be completed by Q4 2024, opening the door to mass production thereafter. This timeline suggests that the Exynos 2500, expected to be used in some Samsung Galaxy S25, could be equipped with this cooling technology, provided that development is completed early in the fourth quarter.
The Exynos 2400 ran a bit hotter than the Snapdragon 8 Gen 3 in testing. Meanwhile, the 2022 Exynos 2200 fared even worse, with significant speed issues. So this packaging technology would be a welcome addition to future Exynos chips if it works as intended, opening the door to more stable performance, better battery life, and cooler phones.
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Developed by Samsung, Exynos chips represent the cornerstone of the company's chip offerings. These advanced processors are designed to power a wide range of devices ranging from smartphones to tablets, delivering exceptional performance and efficiency. Exynos chips incorporate cutting-edge technology, such as advanced CPU architectures, powerful GPUs, and integrated modems, ensuring seamless connectivity and superior computing capabilities. With each iteration, Samsung continues to innovate, pushing the boundaries of what these chips can achieve, thus maintaining Exynos as a key player in the global chip market.
Source: androidauthority
